Simulation experimental investigation on job release control in semiconductor wafer fabrication

  • Authors:

  • Chao Qi;Appa Iyer Sivakumar;Stanley B. Gershwin

  • Affiliations:

  • Singapore-MIT Alliance (SMA), Manufacturing Systems and Technology (MST), Singapore;Nanyang Technological University, Singapore;Massachusetts Institute of Technology, Cambridge, MA

  • Venue:
  • Proceedings of the 39th conference on Winter simulation: 40 years! The best is yet to come
  • Year:
  • 2007

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Abstract

This paper presents a new job release methodology, WIPLOAD Control, especially in semiconductor wafer fabrication environment. The performance of the proposed methodology is evaluated in a simulation study on a simplified wafer fabrication model, in comparison with other existing release control methodologies. A case study is also conducted by simulating a real-life wafer fabrication facility. Based on the experimental results, it appears that WIPLOAD Control is a reliable job release methodology, which can efficiently reduce average cycle time and standard deviation of cycle time for a given throughput level, especially with the increase of system congestion level and system variability caused by stochastic events such as machine unreliability or processing time variability.