CIE '96 Proceedings of the 19th international conference on Computers and industrial engineering
Disassembly of multiple product structures
Computers and Industrial Engineering - Special issue: new advances in analysis of manufacturing systems
Disassembly sequence planning for products with defective parts in product recovery
Proceedings of the 23rd international conference on on Computers and industrial engineering
Issues in environmentally conscious manufacturing and product recovery: a survey
Computers and Industrial Engineering - Special issue on o/perational issues in environmentally conscious manufacturing
Disassembly Scheduling with Parts Commonality Using Petri Nets with Timestamps
Fundamenta Informaticae - Concurrency Specification and Programming (CS&P'2000)
ISEE '03 Proceedings of the Electronics and the Environment, 2003. on IEEE International Symposium
Reconfigurable logistics systems for efficient processes-a new planning tool set
ISEE '03 Proceedings of the Electronics and the Environment, 2003. on IEEE International Symposium
Economic and environmental characteristics of global cellular telephone remanufacturing
ISEE '03 Proceedings of the Electronics and the Environment, 2003. on IEEE International Symposium
ISEE '03 Proceedings of the Electronics and the Environment, 2003. on IEEE International Symposium
Web based ecodesign supporting system for electronic products
ISEE '03 Proceedings of the Electronics and the Environment, 2003. on IEEE International Symposium
An information system management of assessment of disassembly and recycle
ISEE '03 Proceedings of the Electronics and the Environment, 2003. on IEEE International Symposium
DISX: a procedure for the automated generation of disassembly process plans
ISEE '03 Proceedings of the Electronics and the Environment, 2003. on IEEE International Symposium
A switching rule for plastics identification in electronics recycling
International Journal of Computer Integrated Manufacturing
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The recovery of both toxic and non-toxic materials from billions of end-of-life electronics calls for efficient processes and exploration of opportunities for computer integrated demanufacturing for materials recovery. To date, recycling automation for selective disassembly has been limited by the proliferation of product designs, the difficulty of acquiring product feature and material content information, and the lack of integration of collection and demanufacturing processing. Product designs with standard modules and standard fasteners would improve the options for more automated disassembly. Making product structure and material composition information from a product design profile available will support planning models, Petri net algorithms and control models for demanufacturing, as well as integrated manufacturing and demanufacturing. Advances in imaging and materials identification techniques as well as more flexible technologies to separate materials may provide new opportunities for expert Petri net approaches for selective robotic disassembly. Linking end-of-life product service demand information will enhance scheduling for demand-driven demanufacturing. Nonetheless, the random arrival of so many different product sizes and design structures will require new approaches to designing reverse logistics networks and linking their activities. The present paper reviews the research to automate materials recovery planning and control, identifies challenges, and discusses directions for future research.