Wire sweep issue in a newly developed quad flat no-lead (QFN) semiconductor package

  • Authors:

  • S. Abdullah;Z. A. Aziz;I. Ahmad;A. Jalar;M. F. Abdullah

  • Affiliations:

  • Faculty of Engineering, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Faculty of Engineering, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Faculty of Engineering, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Faculty of Engineering, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Faculty of Engineering, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia

  • Venue:
  • MINO'08 Proceedings of the 7th WSEAS International Conference on Microelectronics, Nanoelectronics, Optoelectronics
  • Year:
  • 2008

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Abstract

The expansion of wireless services and other telecom applications increases the need for low-cost highly integrated solutions with very demanding performances and specifications. This requires the development of intelligent front-end architectures that ...