Empirical modeling in the area of technological process optimization and optimization of the burn-in process of electronic devices

Authors:
Radovan Novotny
Affiliations:
Department of Microelectronics, Brno University of Technology, Brno, Czech Republic
Venue:
MAASE'08 Proceedings of the 1st WSEAS International Conference on Multivariate Analysis and its Application in Science and Engineering
Year:
2008

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Reliability, Yield, and Stress Burn-in: A Unified Approach for Microelectronics Systems Manufacturing and Software Development

Reliability, Yield, and Stress Burn-in: A Unified Approach for Microelectronics Systems Manufacturing and Software Development
Design and Analysis of Experiments

Design and Analysis of Experiments

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Abstract

Monitor the microelectronics structures stability, consistency and overall performance need to study variation and influence of various technological factors. This article presents some important aspects related to the observation and analysis of the influence more than one variable at a time on the response of interest. Examples for creating maps of performance stability for supposed device operating conditions and related experience of realized studies are recapitulated here.