Due-date performance improvement using TOC's aggregated time buffer method at a wafer fabrication factory

Authors:
Tsai-Chi Kuo;Sheng-Hung Chang;Shang-Nan Huang
Affiliations:
Department of Industrial Engineering and Management, Minghsin University of Science and Technology, 1 Hsin-Hsing Road, Hsin-Feng, Hsin-Chu County 304, Taiwan, ROC;Department of Industrial Engineering and Management, Minghsin University of Science and Technology, 1 Hsin-Hsing Road, Hsin-Feng, Hsin-Chu County 304, Taiwan, ROC;Department of Industrial Engineering and Management, National Chiao Tung University, 1001 Ta Hsueh Road, Hsinchu 300, Taiwan, ROC
Venue:
Expert Systems with Applications: An International Journal
Year:
2009

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Abstract

Due-date performance is one of the most important production indexes for success utilized by wafer fabrication factories. Traditionally, the industry sets a specific due-date tightness level and a dispatching rule based on the total processing time, the production capacity, pre-defined order release criteria and historical data, to ensure deliveries are made on-time. However, such policies typically do not solve the due-date performance problem at wafer fabrication factories, since the processes are highly complex. This investigation explores the due-date performance problem using the concept of the aggregated time buffer in critical chain project management (CCPM), which was developed by Dr. Goldratt. A simulation model was constructed and the performance of the proposed method is evaluated based on four dispatching rules at a wafer fabrication factory. The findings reveal that applying aggregated time buffer control system improved the overall due-date control, in terms of on-time delivery rate, average tardiness, and variances in average tardiness and lateness.