A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging

Authors:
Zhengjia Wang;Yuhui Wang;Zhouping Yin
Affiliations:
State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, P. R. China 430074;State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, P. R. China 430074;State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, P. R. China 430074
Venue:
ICIRA '08 Proceedings of the First International Conference on Intelligent Robotics and Applications: Part II
Year:
2008

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Abstract

Flip-chip joining using anisotropic conductive adhesive (ACA) has many advantages. But the reliability of ACA interconnection is still a concern issue. There are many studies about the reliability, but little work was done about the bonding process's effect. It is a coupled field problem which needs multi-physics simulation. In order to improve the reliability of the packaging, a parameters optimization method based on multi-physics simulation was developed. A response surface method was used to reduce the computational cost. A generic model was built as an illustration.