Application of self-organizing maps in analysis of wave soldering process

  • Authors:

  • M. Liukkonen;E. Havia;H. Leinonen;Y. Hiltunen

  • Affiliations:

  • University of Kuopio, Department of Environmental Science, P.O. Box 1627, 70211 Kuopio, Finland;Elektroniikan 3K-tehdas, Laitaatsillantie 3, 57170 Savonlinna, Finland;Elektroniikan 3K-tehdas, Laitaatsillantie 3, 57170 Savonlinna, Finland;University of Kuopio, Department of Environmental Science, P.O. Box 1627, 70211 Kuopio, Finland

  • Venue:
  • Expert Systems with Applications: An International Journal
  • Year:
  • 2009

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Abstract

This paper presents an overview of a data analysis method based on self-organizing maps (SOM), a well-known unsupervised neural network learning algorithm, which was applied to a lead-free wave soldering process. The aim of the study was to determine whether the neural network modeling method could be a useful and time-saving way to analyze data from a discrete manufacturing process, such as wave soldering, which is a widely used technique in the electronics industry to solder components on printed circuit boards. The data variables were mostly various process parameters, but also some solder defect numbers were present in the data as a measure of the product quality. The data analysis procedure went as follows. At first, the process data were modeled using the SOM-algorithm. Next, the neuron reference vectors of the formed map were clustered to reveal the desired dominating elements of each territory of the map. At the final stage, the clusters were utilized as sub-models to indicate variable dependencies in these sub-models. The results show that the method presented here can be a good way to analyze this type of process data because interesting interactions between certain process parameters and solder defects were found by means of this data-driven modeling method.