Systematic applications of multivariate analysis to monitoring of equipment health in semiconductor manufacturing

  • Authors:

  • A. G. Chao;S. T. Tseng;D. S. H. Wong;S. S. Jang;S. P. Lee

  • Affiliations:

  • National Tsing Hua University, Hsinchu, Taiwan;National Tsing Hua University, Hsinchu, Taiwan;National Tsing Hua University, Hsinchu, Taiwan;National Tsing Hua University, Hsinchu, Taiwan;Ching Yun University, Jhongli, Taiwan

  • Venue:
  • Proceedings of the 40th Conference on Winter Simulation
  • Year:
  • 2008

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Abstract

In this work, a systematic procedure of building a model for monitoring batch processes in semiconductor manufacturing and visualization of monitoring results will be presented. Semiconductor manufacturing batch-processing stages usually consist of many steps. Aging trends likely to be detected only in the steady state period of each step. Large fluctuations can be found in on-off period of each step. Hence "step-trend" variables, i.e. mean shifts from reference profiles of each steps, are defined to track aging trends. Residuals from this shifted profile are then used to provide a combined health index of each batch through Hotelling T2 analysis.