Analog VLSI and neural systems
Analog VLSI and neural systems
Wafer-Scale Integration Using Restructurable VLSI
Computer - Special issue on wafer-scale integration
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The production of wafer-scale transducer arrays using laser interconnection techniques and micromatching technology is discussed. The design of a wafer-scale thermal dynamic scene simulator that was implemented using the laser-linking redundancy technique is presented to illustrate typical design requirements. The simulator uses small arrays of thermal pixels and control circuitry in 3 mu m CMOS technology.