Moore's Law: another casualty of the financial meltdown?

  • Authors:

  • Jason Cong;N. S. Nagaraj;Ruchir Puri;William Joyner;Jeff Burns;Moshe Gavrielov;Riko Radojcic;Peter Rickert;Hans Stork

  • Affiliations:

  • University of California, Los Angeles, CA;Texas Instrument, Dallas, TX;IBM T J Watson Research Center, Yorktown Heights, NY;SRC, Research Triangle Park, NC;IBM T J Watson Research Center, Yorktown Heights, NY;Xilinx, San Jose, CA;Qualcomm, San Diego, CA;Texas Instrument, Dallas, TX;Applied Materials, Santa Clara, CA

  • Venue:
  • Proceedings of the 46th Annual Design Automation Conference
  • Year:
  • 2009

Quantified Score

Hi-index 0.00

Visualization

Abstract

Given the exponential increase of fabrication costs, the global recession and credit crunch, one may ask if Moore's Law is financially viable beyond 22nm node. Can we justify the return-of-investment (ROI) for continuous scaling beyond 22nm? Shall we consider other alternatives for integration, such as silicon-in-a-package (SiP) or 3D integrations?