Thermal shock modeling of Ultra-High Temperature Ceramics under active cooling

Authors:
Weiguo Li;Fan Yang;Daining Fang
Affiliations:
Failure Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, PR China;Failure Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, PR China;Failure Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, PR China
Venue:
Computers & Mathematics with Applications
Year:
2009

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Abstract

Thermal shock resistance is one of the most important parameters in Ultra-High Temperature Ceramics (UHTCs) since it determines their performance in various applications. In this paper, due to the fact that the material parameters of UHTCs are very sensitive to the variations of temperature, the temperature-dependent thermal shock resistance parameters of UHTCS are studied using an analytical model. The effects of target temperature on the thermal shock behavior of UHTCs thermal protection system (TPS) under active cooling are examined. The calculated results show that thermal shock behavior of the UHTCs' TPS is strongly affected by the target temperature.