A manufacturing system simulation of semiconductor packaging substrate

Authors:
Dug Hee Moon;Kyeong Wook Shin;Chul Soon Park;Dong Soo Kim
Affiliations:
Changwon National University, Changwon, Gyeongnam, Korea;Changwon National University, Changwon, Gyeongnam, Korea;Changwon National University, Changwon, Gyeongnam, Korea;Changwon National University, Changwon, Gyeongnam, Korea
Venue:
SpringSim '09 Proceedings of the 2009 Spring Simulation Multiconference
Year:
2009

Citing 2
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Abstract

The process of semiconductor (IC Package) manufacturing usually includes lots of complex and sequential processes. Many kinds of equipments are installed with the mixed concept of serial and parallel manufacturing system. The business environments of the semiconductor industry have been changed frequently, because new technologies are developed continuously. It is the main reason of new investment plan and layout consideration. However, it is difficult to change the layout after installation, because the major equipments are expensive and difficult to move. Thus, new investment or changing layout should be carefully considered when the production environments are changed likewise product mix and production quantity. This paper introduces a simulation case study of a Korean company that produces packaging substrates (especially lead frames). QUEST® is used for simulation modeling, and various strategies for the environmental changes are evaluated.