Signals & systems (2nd ed.)
Convex Optimization
First-order incremental block-based statistical timing analysis
Proceedings of the 41st annual Design Automation Conference
Correlation-aware statistical timing analysis with non-gaussian delay distributions
Proceedings of the 42nd annual Design Automation Conference
Digital Image Processing (3rd Edition)
Digital Image Processing (3rd Edition)
THE LEADING EDGE OF PRODUCTION WAFER PROBE TEST TECHNOLOGY
ITC '04 Proceedings of the International Test Conference on International Test Conference
Statistical timing analysis with two-sided constraints
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Pattern Recognition and Machine Learning (Information Science and Statistics)
Pattern Recognition and Machine Learning (Information Science and Statistics)
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
A statistical framework for post-silicon tuning through body bias clustering
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Numerical Recipes 3rd Edition: The Art of Scientific Computing
Numerical Recipes 3rd Edition: The Art of Scientific Computing
Post-silicon timing characterization by compressed sensing
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Synthesizing a representative critical path for post-silicon delay prediction
Proceedings of the 2009 international symposium on Physical design
Analyzing the impact of process variations on parametric measurements: novel models and applications
Proceedings of the Conference on Design, Automation and Test in Europe
IEEE Transactions on Information Theory
Statistical timing analysis under spatial correlations
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Proceedings of the 47th Design Automation Conference
Toward efficient spatial variation decomposition via sparse regression
Proceedings of the International Conference on Computer-Aided Design
Proceedings of the International Conference on Computer-Aided Design
Design dependent process monitoring for back-end manufacturing cost reduction
Proceedings of the International Conference on Computer-Aided Design
Active learning framework for post-silicon variation extraction and test cost reduction
Proceedings of the International Conference on Computer-Aided Design
Spatial correlation modeling for probe test cost reduction in RF devices
Proceedings of the International Conference on Computer-Aided Design
Capturing post-silicon variation by layout-aware path-delay testing
Proceedings of the Conference on Design, Automation and Test in Europe
Automatic clustering of wafer spatial signatures
Proceedings of the 50th Annual Design Automation Conference
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In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die variations in nanoscale manufacturing process. VP exploits recent breakthroughs in compressed sensing [15]--[17] to accurately predict spatial variations from an exceptionally small set of measurement data, thereby reducing the cost of silicon characterization. By exploring the underlying sparse structure in (spatial) frequency domain, VP achieves substantially lower sampling frequency than the well-known (spatial) Nyquist rate. In addition, VP is formulated as a linear programming problem and, therefore, can be solved both robustly and efficiently. Our industrial measurement data demonstrate that by testing the delay of just 50 chips on a wafer, VP accurately predicts the delay of the other 219 chips on the same wafer. In this example, VP reduces the estimation error by up to 10x compared to other traditional methods.