A neural network-based prediction model for fine pitch stencil-printing quality in surface mount assembly

  • Authors:
  • Taho Yang;Tsung-Nan Tsai;Junwu Yeh

  • Affiliations:
  • Institute of Manufacturing Engineering, National Cheng Kung University, No. 1, Ta Hsueh Road, Tainan 70101, Taiwan;Department of Industrial Management, Shu-Te University, Kaohsiung 824, Taiwan;Institute of Manufacturing Engineering, National Cheng Kung University, No. 1, Ta Hsueh Road, Tainan 70101, Taiwan

  • Venue:
  • Engineering Applications of Artificial Intelligence
  • Year:
  • 2005

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Abstract

The soldering problems in surface mount assembly can represent considerable production cost increases and yield loss. About 60% of the soldering defect problems can be attributed to the solder paste stencil printing process. This paper proposes to solve a solder-paste stencil-printing quality problem by a neural network approach. Employment of a neuro-computing approach allows multiple inputs to the generation of multiple outputs. In this study, the inputs are composed of eight important factors in modeling the nonlinear behavior of the stencil-printing process for predicting deposited paste volumes. A 3^8^-^3 fractional factorial experimental design is conducted to efficiently collect structured data used for neural network training and testing. The results show that the proposed neural-network model is effective in solving a practical application.