Thermal-aware datapath merging for coarse-grained reconfigurable processors
Proceedings of the Conference on Design, Automation and Test in Europe
| Hi-index | 0.00 |
With the increasing power density of deep submicron technology, temperature becomes one of the dominating factors for the reliability of integrated circuits. Coarse-grained reconfigurable devices typically exhibit spatially nonuniform activity, which results in areas of localized heating, so called hot spots. In this work we investigate the effects of continuous activity migration in order to prevent hot spots. By applying activity migration we are able to reduce temporal and spatial variations of temperature by up to 87%.