Multi-stacked MEMS nano-membranes for coherent extreme ultraviolet emission

  • Authors:
  • Pavel Ustyuzhanin;Yisrael Sundick;Gil Geva-Mittelberg;Yashesh Shroff;Michael Goldstein

  • Affiliations:
  • Intel Electronics Ltd., Jerusalem 91031, Israel;Intel Electronics Ltd., Jerusalem 91031, Israel;Intel Electronics Ltd., Jerusalem 91031, Israel;Intel Corporation, Santa Clara, CA 95054, USA;Intel Corporation, Santa Clara, CA 95054, USA

  • Venue:
  • Microelectronic Engineering
  • Year:
  • 2006

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Abstract

Fabricating precise freestanding metal membranes tens of nanometers thick in a continuous stack with a constant air gap of several microns is a key challenge in a free-electron extreme ultraviolet (EUV) source design program. Such a stack, when exposed to a high energy (~9MeV) electron beam, will operate as an EUV light emitting device. A novel MEMS-based microfabrication technique enables manufacturing of a precise-sized large-area membrane infinite stack for exposure by 1mm diameter electron beam. Thermal self-tensioning is used to reach the required planarity of the membranes.