Intelligent adaptive process control using dynamic deadband for semiconductor manufacturing

  • Authors:
  • Hyo-Heon Ko;Jun-Seok Kim;Jihyun Kim;Jun-Geol Baek;Sung-Shick Kim

  • Affiliations:
  • Division of Information Management Engineering, Korea University, Seoul 136-701, South Korea;BISTel INC, 2F, Jeongpung Bldg, 1341-3, Seocho-dong, Seoul 137-070, South Korea;College of Business Administration, Kwangwoon University, Seoul 139-701, South Korea;Division of Information Management Engineering, Korea University, Seoul 136-701, South Korea;Division of Information Management Engineering, Korea University, Seoul 136-701, South Korea

  • Venue:
  • Expert Systems with Applications: An International Journal
  • Year:
  • 2011

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Abstract

This paper proposes an efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. The photolithography (photo) process forms a complex semiconductor circuit and is important for quality. Obstacles to the process include the facility itself, vibration, wear and tear, product/process changes and environmental influences. Control methodologies being currently used to address these issues often amplify the variation of the process by failing to perform adequate process control. Therefore, this paper proposes an effective process control method to reduce process variance by quickly detecting and identifying process disturbances and accurately reflecting the degree of change to process control. This study proposes dynamic deadband control that uses a region (band) to detect the status of a process change. It adjusts the process control based on the changes detected. In this research, the semiconductor manufacturing company is supported to perform control that is more precise and reduces fluctuations by producing products of uniform quality. In addition, it can contribute to yield due to the quality incentive and increased process control of semiconductor manufacturing.