Optimization of stacked die design on stacked die QFN package by simulation approach

  • Authors:

  • Nur Nadia Bachok;Azami Zaharim;Ibrahim Ahmad;Meor Zainal Meor Talib;Ahmad Kamal

  • Affiliations:

  • Ariffin Ihsan & Noor Baharin Che Kamarudin, ASPAC Research Laboratory, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Ariffin Ihsan & Noor Baharin Che Kamarudin, ASPAC Research Laboratory, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Ariffin Ihsan & Noor Baharin Che Kamarudin, ASPAC Research Laboratory, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Ariffin Ihsan & Noor Baharin Che Kamarudin, ASPAC Research Laboratory, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia;Ariffin Ihsan & Noor Baharin Che Kamarudin, ASPAC Research Laboratory, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia

  • Venue:
  • MACMESE'07 Proceedings of the 9th WSEAS international conference on Mathematical and computational methods in science and engineering
  • Year:
  • 2007

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Abstract

In semiconductor industry, the technology of stacking dies into a package become popular without much consideration of potential reliability issues. However, Finite Element Method has been introduced to semiconductor industry to minimize the experimental cost and times. In this paper, Finite Element Method and statistical analyses are used to optimize the design parameter of stacked die. Birth and death element options are used to determine the die shear stress for manufacturing process. The die shear stress results after the fully processes are used for statistical analysis. Six factors are used in this study to identify the optimal design. It is suggested that, numerical simulation combining with Taguchi Method statistical analyses can be useful tool for optimization of stacked die design parameter.