Method for localizing and measuring structures formed under laser microprocessing

  • Authors:

  • V. P. Bessmeltsev;E. D. Bulushev;N. V. Goloshevsky

  • Affiliations:

  • Laboratory of Laser Graphics, Institute of Automation and Electrometry, Siberian Branch, Russian Academy of Science, Novosibirsk, Russia 630090;Laboratory of Laser Graphics, Institute of Automation and Electrometry, Siberian Branch, Russian Academy of Science, Novosibirsk, Russia 630090;Laboratory of Laser Graphics, Institute of Automation and Electrometry, Siberian Branch, Russian Academy of Science, Novosibirsk, Russia 630090

  • Venue:
  • Pattern Recognition and Image Analysis
  • Year:
  • 2011

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Abstract

To miniaturize the component base, it is necessary to develop new procedures for material processing and the laser technique is one such procedure. Structure geometry formed during laser microprocessing can be changed significantly from the geometry predetermined in the CAD model since the instrumentation settings can be not optimal. To automate the process of choosing parameters for laser microprocessing, a procedure for analyzing images that makes it possible to localize the microstructures for materials with different physical-chemical and optical properties and to obtain the information on its geometrical parameters has been developed.