Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling

Authors:
Ayse Coskun;David Atienza;Mohamed Sabry;Jie Meng
Affiliations:
Boston University;Boston University;Ecole Polytechnique Federale de Lausanne;Ecole Polytechnique Federale de Lausanne
Venue:
IEEE Micro
Year:
2011

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A combined sensor placement and convex optimization approach for thermal management in 3D-MPSoC with liquid cooling

Integration, the VLSI Journal

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Abstract

This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.