DIMP: an interoperable solution for software integration and product data exchange

Authors:
XiVincent Wang;XunWilliam Xu
Affiliations:
Department of Mechanical Engineering, University of Auckland, 20 Symonds Street, Auckland, New Zealand;Department of Mechanical Engineering, University of Auckland, 20 Symonds Street, Auckland, New Zealand
Venue:
Enterprise Information Systems - Information Integration Infrastructures Supporting Multidisciplinary Design Optimisation
Year:
2012

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Abstract

Today, globalisation has become one of the main trends of manufacturing business that has led to a world-wide decentralisation of resources amongst not only individual departments within one company but also business partners. However, despite the development and improvement in the last few decades, difficulties in information exchange and sharing still exist in heterogeneous applications environments. This article is divided into two parts. In the first part, related research work and integrating solutions are reviewed and discussed. The second part introduces a collaborative environment called distributed interoperable manufacturing platform, which is based on a module-based, service-oriented architecture SOA. In the platform, the STEP-NC data model is used to facilitate data-exchange among heterogeneous CAD/CAM/CNC systems.