The evolution of interconnection technology at IBM

Authors:
J. G. Ryan;R. M. Geffken;N. R. Poulin;J. R. Paraszczak
Affiliations:
-;-;-;-
Venue:
IBM Journal of Research and Development
Year:
1995

Citing 3
Cited 4

Contact metallurgy development for VLSI logic

IBM Journal of Research and Development
On-chip wiring for VLSI: status and directions

IBM Journal of Research and Development
Directions in Futrue High End Processors

ICCD '92 Proceedings of the 1991 IEEE International Conference on Computer Design on VLSI in Computer & Processors

Electromigration and stress-induced voiding in fine Al and Al-alloy thin-filmed lines

IBM Journal of Research and Development
Fabrication of magnetic recording heads and dry etching of head materials

IBM Journal of Research and Development
High-density plasma chemical vapor deposition of silicon-based dielectric films for integrated circuits

IBM Journal of Research and Development
The future of interconnection technology

IBM Journal of Research and Development

Quantified Score

Hi-index	0.01

Visualization

Abstract