Modular SoC integration with subsystems: the audio subsystem case

  • Authors:
  • Pieter van der Wolf;Ruud Derwig

  • Affiliations:
  • Synopsys, Eindhoven, The Netherlands;Synopsys, Eindhoven, The Netherlands

  • Venue:
  • Proceedings of the Conference on Design, Automation and Test in Europe
  • Year:
  • 2013

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Abstract

We explore the potential of subsystem-based design to reduce cost and time-to-market in the design of advanced Systems-on-Chips (SoCs) while retaining low-power and high performance processing. Using a concrete audio subsystem as an example, we illustrate the benefits of modular SoC integration with subsystems and identify challenges to be addressed. Well-designed subsystems pre-integrate hardware and software modules to implement complete system functions and offer highlevel hardware and software interfaces for easy SoC integration. Configurability of subsystems enables reuse across SoCs. Subsystems can offer software plug-ins to support integration into a software stack on a host processor while making core crossings transparent for the application programmer. We conclude that subsystems can indeed be the next reuse paradigm for efficient SoC integration.