Fuzzy TOPSIS for multiresponse quality problems in wafer fabrication processes

Authors:
Chiun-Ming Liu;Mei-Yu Ji;Wen-Chieh Chuang
Affiliations:
Department of Industrial Engineering and Systems Management, Feng Chia University, Taichung, Taiwan;Department of Industrial Engineering and Systems Management, Feng Chia University, Taichung, Taiwan;Department of Industrial Engineering and Systems Management, Feng Chia University, Taichung, Taiwan
Venue:
Advances in Fuzzy Systems - Special issue on Advanced Fuzzy Methods in Decision Making and Data Analysis
Year:
2013

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Abstract

The quality characteristics in the wafer fabrication process are diverse, variable, and fuzzy in nature. How to effectively deal with multiresponse quality problems in the wafer fabrication process is a challenging task. In this study, the fuzzy technique for order preference by similarity to an ideal solution (TOPSIS), one of the fuzzy multiattribute decision-analysis (MADA) methods, is proposed to investigate the fuzzy multiresponse quality problem in integrated-circuit (IC) wafer fabrication process. The fuzzy TOPSIS is one of the effective fuzzy MADA methods for dealing with decision-making problems under uncertain environments. First, a fuzzy TOPSIS methodology is developed by considering the ambiguity between quality characteristics. Then, a detailed procedure for the developed fuzzy TOPSIS approach is presented to show how the fuzzy wafer fabrication quality problems can be solved. Real-world data is collected from an IC semiconductor company and the developed fuzzy TOPSIS approach is applied to find an optimal combination of parameters. Results of this study show that the developed approach provides a satisfactory solution to the wafer fabrication multiresponse problem. This developed approach can be also applied to other industries for investigating multiple quality characteristics problems.