Process modeling for advanced device technologies

  • Authors:

  • S. M. Cea;S. Botelho;A. Chaudhry;P. Fleischmann;M. D. Giles;A. Grigoriev;A. Kaushik;P. H. Keys;H. W. Kennel;A. D. Lilak;R. Mehandru;M. Stettler;B. Voinov;N. Voynich;C. Weber;N. Zhavoronok

  • Affiliations:

  • Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124;Process Technology Modeling, Intel Corporation, Hillsboro, USA 97124

  • Venue:
  • Journal of Computational Electronics
  • Year:
  • 2014

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Abstract

Front end process simulation is an invaluable tool in assessing current and future process options. This review describes the application of process simulation in modeling geometry, doping and stress effects in advanced logic processes. Continuum and atomistic approaches, both necessary to capture the physics involved with the most advanced options, are discussed. Also detailed are advancements in numerical techniques which enable the efficient and robust simulation necessary to keep pace with technology development.