Recent developments in high integration multi-standard CMOS transceivers for personal communication systems

  • Authors:
  • Jacques C. Rudell;Jia-Jiunn Ou;R. Sekhar Narayanaswami;George Chien;Jeffrey A. Weldon;Li Lin;King-Chun Tsai;Luns Tee;Kelvin Khoo;Danelle Au;Troy Robinson;Danilo Gerna;Masanori Otsuka;Paul R. Gray

  • Affiliations:
  • Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley;STMicroelectronics;Hitachi, Ltd.;Department of Electrical Engineeringand Computer Scinces, University of California at Berkeley

  • Venue:
  • ISLPED '98 Proceedings of the 1998 international symposium on Low power electronics and design
  • Year:
  • 1998

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Abstract

Issues associated with the integration of transceiver components on to a single silicon substrate are discussed. In particular, recently proposed receiver and transmitter architectures for high integration are examined on the promise of providing multistandard capability. In addition, existing barriers to lower power transceiver operation are examined as well as some proposed directions for future integrated transceiver research and development.