Application of equilibrium thermodynamics to the development of diffusion barriers for copper metallization (invited)

• Authors:

• C. E. Ramberg;E. Blanquet;M. Pons;C. Bernard;R. Madar

• Affiliations:

• -;-;-;-;-

• Venue:
• Proceedings of the third Europeon workshop on Materials for advanced metallization
• Year:
• 1999