Simulation Modeling and Analysis
Simulation Modeling and Analysis
Introduction to Simulation Using SIMAN
Introduction to Simulation Using SIMAN
Proceedings of the 35th conference on Winter simulation: driving innovation
Symbiotic Simulation Control in Semiconductor Manufacturing
ICCS '08 Proceedings of the 8th international conference on Computational Science, Part III
Proceedings of the 40th Conference on Winter Simulation
Analysis of multiple process flows in an ASIC fab with a detailed photolithography area model
Proceedings of the 40th Conference on Winter Simulation
An optimization framework for waferfab performance enhancement
Proceedings of the 40th Conference on Winter Simulation
Symbiotic simulation for optimisation of tool operations in semiconductor manufacturing
Proceedings of the Winter Simulation Conference
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In semiconductor manufacturing, furnaces are used for diffusion and deposition operations. A furnace is a batch processing machine, which can simultaneously process a number of lots together as a batch. Whenever a furnace becomes available, scheduling the next batch involves decisions on both which operation to process next (dispatching policy) and how many lots to put into the batch (loading policy). A simulation model of a wafer fabrication facility is used to examine the effects of different loading and dispatching policies for diffusion operations. Results indicate that the loading policy has a significant effect on the average diffusion flow time as well as the overall cycle time of the products, whereas dispatching policy has a less significant effect. We show that the production volume of a product should be considered in setting the minimum number of lots needed to start a batch. We suggest that the diffusion flow time for a low volume product can be reduced by releasing the product in batches or by setting the minimum batch size such that the work-in-process of the product can be moved faster.