Microvias: The Next Generation of Substrates and Packages

Authors:
Happy Holden
Affiliations:
-
Venue:
IEEE Micro
Year:
1998

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Cited 1

Chip-scale packaging

IEEE Spectrum

The WearARM Modular, Low-Power Computing Core

IEEE Micro

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Abstract

The silicon revolution continues its rapid advances. New functionality in silicon, more I/Os per components and shrinking discreet components sizes are providing the opportunity for rapid product enhancements. Area array packages and now the new chip-size packages are creating a demand for higher and higher PCB density. The PCB has been the venerable cost-effective packaging solution of choice.