Boosting software fault injection for dependability analysis of real-time embedded applications
ACM Transactions on Embedded Computing Systems (TECS)
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The goal of this paper is to present BOND, a Software Fault Injection tool able to simulate abnormal behavior of a computer system running Windows NT 4.0 Operating System. The Fault Injector is based on interposition techniques, which guarantees a low impact on the execution of the target program, and allows the injection of Commercial off-the-Shelf software programs. BOND allows performing both statistical and deterministic Fault Injection experiments, trading-off between overhead and precision of the obtained results. Moreover, the tool is capable of injecting faults into different locations, at any level of the application context (code and data sections, stack, heap, processor's registers, system calls, ...). A complete set of experimental results on different application programs demonstrates the effectiveness and the flexibility of the tool.