A low-energy chip-set for wireless intercom

Authors:
M. Josie Ammer;Michael Sheets;Tufan Karalar;Mika Kuulusa;Jan Rabaey
Affiliations:
University of California, Berkeley;University of California, Berkeley;University of California, Berkeley;University of California, Berkeley;University of California, Berkeley
Venue:
Proceedings of the 40th annual Design Automation Conference
Year:
2003

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Abstract

A low power wireless intercom system is designed and implemented. Two fully-operational ASICs, integrating custom and commercial IP, implement the entire digital portion of the protocol stack. Combined, the chips consume 13 mW on average when three nodes are connected to the network. A high-level design methodology was used to define the protocol stack and communication algorithms, select architectures, and minimize energy.