Three-dimensional Integrated Circuit Design
Three-dimensional Integrated Circuit Design
Performance/Thermal-Aware Design of 3D-Stacked L2 Caches for CMPs
ACM Transactions on Design Automation of Electronic Systems (TODAES)
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Next generation, wide-issue processors will require greater memory bandwidth than provided by present memory hierarchy designs. We propose techniques for increasing the memory bandwidth of multi-ported L1 Dcaches, large on-chip L2 caches, and dedicated memory ports while minimizing cycle time impact. These approaches are evaluated within the context of an 8-way superscalar processor design and next-generation VLSI, packaging, and RAM technologies. We show that the combined L1 and L2 cache enhancements can outperform conventional techniques by over 80%, and that even with an on-chip 512KB L2 cache, board-level caches provide significant enough performance gains to justify their higher cost.