Incorporating heuristic information into genetic search
Proceedings of the Second International Conference on Genetic Algorithms on Genetic algorithms and their application
Toward a unified thermodynamic genetic operator
Proceedings of the Second International Conference on Genetic Algorithms on Genetic algorithms and their application
A Novel Low-Cost Approach to MCM Interconnect Test
Proceedings of the IEEE International Test Conference on Driving Down the Cost of Test
The traveling salesman: computational solutions for TSP applications
The traveling salesman: computational solutions for TSP applications
Ant colony system: a cooperative learning approach to the traveling salesman problem
IEEE Transactions on Evolutionary Computation
IEEE Transactions on Neural Networks
Combinatorial optimization with use of guided evolutionary simulated annealing
IEEE Transactions on Neural Networks
| Hi-index | 0.00 |
Multi-chip Module (MCM) technology has become an important means to package high performance systems. However, wide usage of MCM technology has been restricted by the cost of design, fabrication and testing. Since electrical testing can cost as high as 50% of the MCM cost in the near future, an efficient MCM substrate test scheme is needed to ensure system reliability and reduce test cost. Numerous techniques are being pursued in the industry for testing unpopulated MCM substrates. Recently, a novel technique for testing MCM substrate using single-ended probe has been developed [1]. In this paper, we present a heuristic algorithm to reduce the single-ended probe travel time in MCM substrate testing. Using our new novel heuristic algorithm, the test cost is dramatically reduced.