Project Management for System-on-Chip Using Multi-Chip Modules

  • Authors:
  • Donald J. Dent

  • Affiliations:
  • -

  • Venue:
  • ISQED '00 Proceedings of the 1st International Symposium on Quality of Electronic Design
  • Year:
  • 2000

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Abstract

Mutli-Chip Module (MCM) projects are complex, in terms of the technology used, and are expensive, typically in excess of $50,000. MCM technology is very unforgiving in that mistakes cannot be easily rectified or the device easily re-worked. The Mosaic Earth Sensor Mutli-Chip Module (MESMCM) project, which was the subject of a case study, was a high speed, first-of-a-kind development that ran into some difficulties in spite of rigorous project management. It is intended to compare the project management structure used for a technology demonstrator with the new structure used on subsequent MCM designs. One of the outcomes of this case study was that the management of an MCM project is just as crucial as the technical aspects and resulted in several guidelines about the nature and composition of the design team. The lessons learned from the MESMCM project were applied very effectively to further MCM designs.