Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry

  • Authors:

  • S. Evoy;N. DiLello;V. Deshpande;A. Narayanan;H. Liu;M. Riegelman;B. R. Martin;B. Hailer;J.-C. Bradley;W. Weiss;T. S. Mayer;Y. Gogotsi;H. H. Bau;T. E. Mallouk;S. Raman

  • Affiliations:

  • Department of Electrical and Systems Engineering, The University of Pennsylvania, 200 S, 33rd St., Room 206, Philadelphia, PA;Department of Electrical and Systems Engineering, The University of Pennsylvania, 200 S, 33rd St., Room 206, Philadelphia, PA;Department of Electrical and Systems Engineering, The University of Pennsylvania, 200 S, 33rd St., Room 206, Philadelphia, PA;Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University of Pennsylvania, Philadelphia, PA;Department of Mechanical Engineering and Applied Mechanics, The University of Pennsylvania, Philadelphia, PA;Department of Mechanical Engineering and Applied Mechanics, The University of Pennsylvania, Philadelphia, PA;Department of Chemistry, Pennsylvania State University, University Park, PA;Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA;Department of Chemistry, Drexel University, Philadelphia, PA;Department of Chemistry, Pennsylvania State University, University Park, PA;Department of Electrical Engineering, Pennsylvania State University, University Park, PA;Department of Materials Science & Engineering, Drexel University, Philadelphia, PA;Department of Mechanical Engineering and Applied Mechanics, The University of Pennsylvania, Philadelphia, PA;Department of Chemistry, Pennsylvania State University, University Park, PA;Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University of Pennsylvania, Philadelphia, PA

  • Venue:
  • Microelectronic Engineering - Proceedings of the symposium on characterization and mechanical reliability of advanced electronic materials at nanoscale, 2003 ASME mechanics and materials conference
  • Year:
  • 2004

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Abstract

We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on "striped" high aspect ratio cylindrical structures grown using porous membranes as templates. These nanostructures are manipulated using dielectrophoretic forces, allowing their individual assembly and characterization. This assembly also enables the development of "mixed-mode" integrated circuits that include readout, signal processing, and communications circuitry, as well as the requisite layout for the post-IC assembly of the nanostructures. We report on preliminary designs of such mixed mode systems whose layouts integrate dielectrophoretic assembly sites with a rudimentary resistance read-out circuitry.