The simulation of cluster tools: a new semiconductor manufacturing technology
WSC '94 Proceedings of the 26th conference on Winter simulation
The simulation of integrated tool performance in semiconductor manufacturing
WSC '93 Proceedings of the 25th conference on Winter simulation
WSC '91 Proceedings of the 23rd conference on Winter simulation
Evaluation of cluster tool throughput for thin film head production
Proceedings of the 31st conference on Winter simulation: Simulation---a bridge to the future - Volume 1
Using simulation and genetic algorithms to improve cluster tool performance
Proceedings of the 31st conference on Winter simulation: Simulation---a bridge to the future - Volume 1
Simulation graphical modeling and analysis (SIGMA) tutorial (tutorial session)
WSC' 90 Proceedings of the 22nd conference on Winter simulation
Simulation modeling with event graphs
Communications of the ACM
Proceedings of the 32nd conference on Winter simulation
Simulation Modeling and Analysis
Simulation Modeling and Analysis
Proceedings of the 34th conference on Winter simulation: exploring new frontiers
Process equipment modeling: application of cluster tool modeling to a 300 mm fab simulation
Proceedings of the 35th conference on Winter simulation: driving innovation
Estimating expected completion times with probabilistic job routing
Proceedings of the 38th conference on Winter simulation
Information models for queueing system simulation
ACM Transactions on Modeling and Computer Simulation (TOMACS)
Using simulation and hybrid sequencing optimization for makespan reduction at a wet tool
Proceedings of the Winter Simulation Conference
Performance improvement for a wet bench tool
Proceedings of the Winter Simulation Conference
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This paper describes a resident-entity based pilot simulation study of a class of tools used in 300mm semiconductor manufacturing known as the wets tools or the wet benches. These are batch chamber tools - they have several chambers or tanks, each of which can accommodate a batch of wafers, usually more than one lot size. We develop a simulation model for the wets processing area that is based on the resident-entity paradigm, but makes use of transient-entity-type modeling when more information needs to be tracked. Resident-entity models tend to be much faster than transientity simulation models that are common in semiconductor manufacturing. The model developed captures most of the internal workings of a wets tool and at the same time, models different types of tools. We used the model to evaluate the effects of scheduling policies and batching parameters on the performance of the wets process area.