Micro bonding with non-viscous adhesives

Authors:
S. Böhm;K. Dilger;J. Hesselbach;J. Wrege;S. Rathmann;W. Ma;E. Stammen;G. Hemken
Affiliations:
Institute of Joining and Welding (IFS), Technical University Braunschweig, Langer Kamp 8, 38106, Braunschweig, Germany;Institute of Joining and Welding (IFS), Technical University Braunschweig, Langer Kamp 8, 38106, Braunschweig, Germany;Institute of Machine Tools and Production Technology (IWF), Technical University Braunschweig, Langer Kamp 19, 38106, Braunschweig, Germany;Institute of Machine Tools and Production Technology (IWF), Technical University Braunschweig, Langer Kamp 19, 38106, Braunschweig, Germany;Institute of Machine Tools and Production Technology (IWF), Technical University Braunschweig, Langer Kamp 19, 38106, Braunschweig, Germany;Institute of Machine Tools and Production Technology (IWF), Technical University Braunschweig, Langer Kamp 19, 38106, Braunschweig, Germany;Institute of Joining and Welding (IFS), Technical University Braunschweig, Langer Kamp 8, 38106, Braunschweig, Germany;Institute of Joining and Welding (IFS), Technical University Braunschweig, Langer Kamp 8, 38106, Braunschweig, Germany
Venue:
Microsystem Technologies - Special issue: Colloquium on Micro Production, Aachen, Germany, 2-3 March 2005
Year:
2006

Citing 0
Cited 2

A new ultrasonic precise bonding method with ultrasound propagation feedback for polymer MEMS

Microelectronic Engineering
Realization of an automated microassembly task involving micro adhesive bonding

International Journal of Automation and Computing

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Abstract

The new subproject B8 “Adhesive processing in batch technology for the manufacturing of microsystems” has the goal to compile bases for batchable joining techniques based on adhesive systems. This paper presents an alternative adhesive bonding system, which is able to join very small parts as well as relatively big parts with high accuracy requirements. The main advantages are the possibility to apply small volumes, to pre-apply the adhesive with a temporarily delayed joining procedure and extremely short set cycles. Therefore, using hot melts can be a technologically and economically interesting alternative for the assembly and packaging of MEMS.