Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects

  • Authors:
  • E. J. Yarmchuk;C. W. Cline;D. C. Bruen

  • Affiliations:
  • -;-;-

  • Venue:
  • IBM Journal of Research and Development - POWER5 and packaging
  • Year:
  • 2005

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Abstract

Nonlinear electrical conduction effects arising from local heating provide a means for detecting the presence of latent defects that are at risk of becoming open electronic circuits under stress. A special choice of ac drive current results in a dc intermodulation signal produced by nonlinear conduction, and offers several practical advantages over previous techniques involving ac harmonics. A key feature is the use of digital signal processing to provide speed, accuracy, and flexibility of measurement. A manufacturing screening system involving an automated prober integrated with the defect-detection tool is used to test high-performance glass-ceramic substrate interconnects used in advanced microelectronic packaging.