Simulation-based scheduling of parallel wire-bonders with limited clamp&paddles

  • Authors:

  • Daniel Quadt

  • Affiliations:

  • Infineon Technologies AG, Regensburg, Germany

  • Venue:
  • Proceedings of the 38th conference on Winter simulation
  • Year:
  • 2006

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Abstract

We present a scheduling procedure for the wire-bonding operation of a semiconductor assembly facility. The wire-bonding operation typically consists of a large number of unrelated parallel machines and is typically one of the bottlenecks in an assembly facility. The scheduling procedure is able to handle setup times, limited fixtures (clamp&paddles) and non-zero machine ready-times (initial work in progress). It is based on a simulator that generates a schedule and a Simulated Annealing approach to optimize the schedule. Some preliminary results from an implementation in a large assembly facility are given.