Microsystem design
Dry release of suspended nanostructures
Microelectronic Engineering - Proceedings of the 29th international conference on micro and nano engineering
Design and fabrication of in-plane resonant microcantilevers
Microelectronics Journal
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A new approach was developed in this work to fabricate metallic nano-cantilevers using a one-mask process and a deep reactive ion etch (DRIE) technique. 40-nm-thick Al and 70-nm-thick Au cantilevers of lengths from 5@mm and widths in the range of 200-300nm were fabricated on a silicon substrate. The silicon underneath the suspended beams was completely etched. Short Al nano-cantilevers were used to find local residual stress induced in rapid thermal oxidation and the oxidized spots according to the deflection profiles of the nano-cantilevers. The deflection profiles were determined with the aid of a scanning electron microscope (SEM). Compared with a single feedback in the existing cantilever-based static methods, i.e., the deflection of the open end of a cantilever, the whole deflection profile provides more information regarding the effect of surface stresses on a cantilever.