A selective CMP process for stacked low-k CVD oxide films
Proceedings of the third Europeon workshop on Materials for advanced metallization
Placement of piezoelectric ceramic sensors in ultrasonic wire-bonding transducers
Microelectronic Engineering
Electrochemical aspects of new materials and technologies in microelectronics
Microelectronic Engineering
Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces
Microelectronic Engineering
Surface Oxide evolution on Al-Si bond wires for high-power RF applications
Microelectronic Engineering - Proceedings of the symposium on characterization and mechanical reliability of advanced electronic materials at nanoscale, 2003 ASME mechanics and materials conference
Journal of Intelligent Manufacturing
| Hi-index | 2.88 |
A new bonding-tool solution is proposed to improve stitch bondability by creating a new surface morphology on the tip surface of a wire-bonding tool (capillary). The surface has relatively deep lines with no fixed directions. This new capillary has less slipping between the wire and the capillary tip surface and provides better coupling effect between them. Experiments of wire bonding on unstable lead frames/substrates, alloyed wire (2N gold wire) bonding, and copper wire bonding were carried out to confirm the effect of the new capillary on the stitch bondability. The experimental results are promising and have proved that the use of the new capillary could improve the bondability of the stitch bond and minimize the occurrence of short tail defects and non-sticking on lead during bonding.