Stable and compact inductance modeling of 3-D interconnect structures

  • Authors:
  • Hong Li;Venkataramanan Balakrishnan;Cheng-Kok Koh

  • Affiliations:
  • Purdue University, West Lafayette, IN;Purdue University, West Lafayette, IN;Purdue University, West Lafayette, IN

  • Venue:
  • Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2006

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Abstract

Recent successful techniques for the efficient simulation of largescale interconnect models rely on the sparsification of the inverse of the inductance matrix L. While there are several techniques for sparsifying L-1, the stability of these approximations for general interconnect structures has not been established, i.e., the sparsified reluctance and inductance matrices are not guaranteed to be positive-definite. In this paper, we present a novel technique for reluctance sparsification for general interconnect structures that enjoys several advantages: First, the resulting sparse approximation is guaranteed to be positive definite. Second, the approximation is optimal, in a certain well-defined sense. Third, owing to its computational efficiency and numerical stability, the algorithm is applicable for very large problem sizes. Finally our approach yields a compact representation of both inductance and reluctance matrices for general cases.