CMOS temperature sensor with ring oscillator for mobile DRAM self-refresh control

  • Authors:
  • Chan-Kyung Kim;Jae-Goo Lee;Young-Hyun Jun;Chil-Gee Lee;Bai-Sun Kong

  • Affiliations:
  • DRAM Design Team, Memory Division, Semiconductor Business, Samsung Electronics Co. Ltd., San 16, Banwol-Ri, Taean-Eup, Hwasung-City, Kyeonggi-Do 445-701, Korea and School of Information and Commun ...;DRAM Design Team, Memory Division, Semiconductor Business, Samsung Electronics Co. Ltd., San 16, Banwol-Ri, Taean-Eup, Hwasung-City, Kyeonggi-Do 445-701, Korea;DRAM Design Team, Memory Division, Semiconductor Business, Samsung Electronics Co. Ltd., San 16, Banwol-Ri, Taean-Eup, Hwasung-City, Kyeonggi-Do 445-701, Korea;School of Information and Communication Engineering, Sungkyunkwan University, 300, ChunChun-Dong, Jangan-Gu, Suwon-City, Kyeonggi-Do 440-746, Korea;School of Information and Communication Engineering, Sungkyunkwan University, 300, ChunChun-Dong, Jangan-Gu, Suwon-City, Kyeonggi-Do 440-746, Korea

  • Venue:
  • Microelectronics Journal
  • Year:
  • 2007

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Abstract

This paper presents novel low-cost CMOS temperature sensor for controlling the self-refresh period of a mobile DRAM. In the proposed temperature sensor, the temperature dependency of poly resistance is used to generate a temperature-dependent bias current, and a ring oscillator driven by this bias current is employed to obtain the digital code pertaining to on-chip temperature. This method is highly area-efficient, simple and easy for IC implementation as compared to traditional temperature sensors based on bandgap reference. The proposed CMOS temperature sensor was fabricated with an 80nm 3-metal DRAM process, which occupies extremely small silicon area of only about 0.016mm^2 with under 1@mW power consumption for providing 0.7^oC effective resolution at 1 sample/s processing rate. This result indicates that as much as 73% area reduction was obtained with improved resolution as compared to the conventional temperature sensor in mobile DRAM.