Polymer self assembly in semiconductor microelectronics

  • Authors:
  • C. T. Black;R. Ruiz;Gregory Breyta;J. Y. Cheng;M. E. Colburn;K. W. Guarini;H.-C. Kim;Y. Zhang

  • Affiliations:
  • Brookhaven National Laboratory, Center for Functional Nanomaterials, Upton, New York;Hitachi Global Storage Techologies, San Jose, California;IBM Research Division, Almaden Research Center, San Jose, California;IBM Research Division, Almaden Research Center, San Jose, California;IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York;IBM Systems and Technology Group, New York;IBM Research Division, Almaden Research Center, San Jose, California;IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York

  • Venue:
  • IBM Journal of Research and Development
  • Year:
  • 2007

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Abstract

We are inspired by the beauty and simplicity of self-organizing materials and the promise they hold for enabling continued improvements in semiconductor technology. Self assembly is the spontaneous arrangement of individual elements into regular patterns," under suitable conditions, certain materials self organize into useful nanometer-scale patterns of importance to high-performance microelectronics applications. Polymer self assembly is a nontraditional approach to patterning integrated circuit elements at dimensions and densities inaccessible to traditional lithography methods. We review here our efforts in IBM to develop and integrate self-assembly processes as high-resolution patterning alternatives and to demonstrate targeted applications in semiconductor device fabrication. We also provide a framework for understanding key requirements for the adoption of polymer self-assembly processes into semiconductor technology, as well as a discussion of the ultimate dimensional scalability of the technique.