Power supply noise analysis methodology for deep-submicron VLSI chip design

  • Authors:
  • Howard H. Chen;David D. Ling

  • Affiliations:
  • IBM Research Division Thomas J. Watson Research Center Yorktown Heights, NY;IBM Research Division Thomas J. Watson Research Center Yorktown Heights, NY

  • Venue:
  • DAC '97 Proceedings of the 34th annual Design Automation Conference
  • Year:
  • 1997

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Abstract

This paper describes a new design methodology to analyzethe on-chip power supply noise for high-performance microprocessors.Based on an integrated package-level andchip-level power bus model, and a simulated switching circuitmodel for each functional block, this methodology offersthe most complete and accurate analysis of Vdd distributionfor the entire chip. The analysis results not only providedesigners with the inductive 驴I noise and the resistive IRdrop data at the same time, but also allow designers to easilyidentify the hot spots on the chip and 驴V across the chip.Global and local optimization such as buffer sizing, powerbus sizing, and on-chip decoupling capacitor placement canthen be conducted to maximize the circuit performance andminimize the noise.