Macro-modeling concepts for the chip electrical interface

  • Authors:
  • Brian W. Amick;Claude R. Gauthier;Dean Liu

  • Affiliations:
  • Sun Microsystems Inc., Austin, TX;Sun Microsystems Inc., Sunnyvale, CA;Sun Microsystems Inc., Sunnyvale, CA

  • Venue:
  • Proceedings of the 39th annual Design Automation Conference
  • Year:
  • 2002

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Abstract

The power delivery network is made up of passive elements in the distribution network, as well as the active transistor loads. A chip typically has three types of power supplies that require attention: core, I/O, and analog. Core circuits consist of digital circuits and have the largest current demand. In addition to all of the system issues/models for the core, modeling the I/O subsystem has the additional requirement of modeling return paths and discontinuities. The analog circuits present yet a different challenge to the macro-modeling of the supply network because they place a tight demand on supply variations. This paper presents a design methodology on how to generate macro-models of the entire chip electrical interface. This methodology can be used by the chip, package, and system designers and is being used to design high-reliability servers.