Model and analysis for combined package and on-chip power grid simulation

  • Authors:
  • Rajendran Panda;David Blaauw;Rajat Chaudhry;Vladimir Zolotov;Brian Young;Ravi Ramaraju

  • Affiliations:
  • Motorola, Inc., Austin, TX;Motorola, Inc., Austin, TX;Motorola, Inc., Austin, TX;Motorola, Inc., Austin, TX;Motorola, Inc., Austin, TX;Motorola, Inc., Austin, TX

  • Venue:
  • ISLPED '00 Proceedings of the 2000 international symposium on Low power electronics and design
  • Year:
  • 2000

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Abstract

We present new modeling and simulation techniques to improve the accuracy and efficiency of transient analysis of large power dis冒tribution grids. These include an accurate model for the inherent decoupling capacitance of non-switching devices, as well as a sta冒tistical switching current model for the switching devices. More冒over, three new simulation techniques are presented for problem size-reduction and speed-up. Results of application of these tech冒niques on three PowerPCtmmicroprocessors are also presented.