Design and analysis of power distribution networks in PowerPC microprocessors
DAC '98 Proceedings of the 35th annual Design Automation Conference
Hierarchical analysis of power distribution networks
Proceedings of the 37th Annual Design Automation Conference
Model and analysis for combined package and on-chip power grid simulation
ISLPED '00 Proceedings of the 2000 international symposium on Low power electronics and design
On the interaction of power distribution network with substrate
ISLPED '01 Proceedings of the 2001 international symposium on Low power electronics and design
Supply noise suppression by triple-well structure
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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Editor's note:Although it is tempting to think of the power grid as an independent medium of the transfer of energy from the package to the devices in the IC, some second-order technology-related effects can sometimes cause unforeseen problems. This article focuses especially on the relationship of the power delivery system to the silicon substrate properties, and shows how a low-impedance substrate can make a substantial difference in the noise generated by the power grid.ýSani R. Nassif, IBM Austin Research Laboratory