Power supply noise analysis methodology for deep-submicron VLSI chip design
DAC '97 Proceedings of the 34th annual Design Automation Conference
A novel VLSI layout fabric for deep sub-micron applications
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Effects of inductance on the propagation delay and repeater insertion in VLSI circuits
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Simultaneous shield insertion and net ordering for capacitive and inductive coupling minimization
ISPD '00 Proceedings of the 2000 international symposium on Physical design
Decoupling capacitance allocation for power supply noise suppression
Proceedings of the 2001 international symposium on Physical design
An algorithm for optimal decoupling capacitor sizing and placement for standard cell layouts
Proceedings of the 2002 international symposium on Physical design
A roadmap and vision for physical design
Proceedings of the 2002 international symposium on Physical design
Cross-talk immune VLSI design using a network of PLAs embedded in a regular layout fabric
Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design
IC power distribution challenges
Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Challenges in power-ground integrity
Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Pseudopin assignment with crosstalk noise control
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
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In recent deep submicron VLSI design, signal integrity (SI) and power-ground integrity (PGI) have become very important to design in a short time. As a solution, we propose DEPOGIT, which is a new dense power-ground interconnect architecture that realizes more robust physical design integrity. This architecture is a method of running both the power and ground wires adjacent to the signal wires. This provides not only the general shielding effect but also explicit decoupling capacitance (decap) by means of the wires. Using this architecture also guarantees regularity, thus reducing manufacturing variations in interconnects.As a result of quantitative analysis performed using 90 nm technology node, we demonstrate that high-quality decap of over 50 nF in a 10 mm square chip can be obtained, the resistive IR-drop can be less than 20% of that of a conventional power grid, transient peak noise can be reduced by about 80%, and the inductive crosstalk effect of the signal wire can be greatly reduced.