Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Reducing power density through activity migration
Proceedings of the 2003 international symposium on Low power electronics and design
Thermal-Aware Clustered Microarchitectures
ICCD '04 Proceedings of the IEEE International Conference on Computer Design
Psychoacoustics: Facts and Models
Psychoacoustics: Facts and Models
Don't burn your mobile!: safe computational re-sprinting via model predictive control
Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
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As the trend towards higher performance with increased integration continues, the emerging platform technology challenges require innovation across multiple disciplines at low cost to deliver compelling products. Customers demand increased performance to enable new usage models across all market segments in ever-constrained form factors. To complement voltage scaling and leakage issues associated with silicon, it is necessary to advance the thermal management and acoustics technologies at the system level. On the other hand, architectural tradeoffs are required to extract maximum performance for a given energy budget. In this paper, we outline the challenges and present a few ideas to expand the performance envelope of future platforms. These challenges should also function as a motivation to the research community at large to develop breakthrough innovations.